Meeting your Peers Engineers #5: The Evolution of Sintering and Molding Technologies

Noviotech Campus invite all engineers from semiconductor companies in the region to join the 5th edition of Meeting Your Peers for Engineers. A lunch event for sharing knowledge and connecting with semicon peers.

This time, we’ve invited Boschman Advanced Packaging Technology to tell us more about their company and their expertise in Sinter and Mold technology.

Company Introduction – Eef Boschman (CEO, Boschman Advanced Packaging Technology)

Boschman Advanced Packaging Technology is a (partly) family-owned high-tech company that develops and manufactures pressure sinter and advanced molding equipment, focusing on the Power electronics market. With their patented DIT technology and an installed base of 200 Pressure sinter systems, Boschman is market leader (70+% market share) in the field of pressure sinter equipment, supplying to major Automotive OEM and Tier1 customers.

Pressure Sinter Technology – Emiel de Bruin (Director of Technology, Boschman Advanced Packaging Technology)

Pressure sintering is widely adopted in the power electronics market as the chip interconnect technology of choice. Boschman will discuss the challenges in pressure sintering and equipment developments needed to remain competitive and the supplier of choice.

Advanced Molding Technology – Eef Boschman (CEO, Boschman Advanced Packaging Technology)

From the early days, Boschman has focused their molding developments in areas where die surfaces or specific areas of the package must remain free of compound/flash. These technologies have evolved and are now widely used in the power electronics sector for EV applications. Lunch will be provided, courtesy of Boschman, the event’s lunch sponsor. We look forward to seeing you there!

Program:

12:00 – 12:30 Walk-in & lunch @ Pop-up event venue

12:30 – 12:45 Company introduction – Eef Boschman (CEO)

12:45 – 13:40 In-depth presentations: • Pressure sinter technology – Emiel de Bruin (Director of Technology) • Advanced molding technology – Eef Boschman (CEO)

13:40 – 13:45 Wrap-up & end

Sign up via this link.